Artificial Intelligence PCBA

Artificial Intelligence PCBA

Artificial intelligence technology involves the Internet of Things, cloud computing, big data, edge computing and other content. The research direction including learning machine, natural language processing, knowledge representation, automatic reasoning, computer vision and robot vision. The main application areas are mainly focused on education, medical, driverless, e-commerce retail, finance, personal assistant, campus, home, showroom and other vertical areas in a number of scenarios. Artificial intelligence on the motherboard's high requirements are mainly reflected in: strong performance of the processor, ultra-high arithmetic support, super display performance, support for ultra-high definition output, ultra-high scalability and rich network support.

As a PCB design and PCB assembly company with more than 20 years of experience, Minteda has advanced international technology, intelligent production and testing equipment to meet your requirements. In the field of artificial intelligence, we provide you with the following types of artificial intelligence motherboard products, from small batch prototyping to mass production, including PCB design, PCBA mounting and DIP packaging services.

Interactive learning

AR learning

IOT gateway

Process Capability

Solder paste printer printing accuracy: ±0.02mm

Printing repeat positioning accuracy: ±0.0125mm

Equipment reject material rate: within 5 parts per million

Mounting component size: CHIP 01005 (imperial system) ~ 100*90*21mm IC

Mounting accuracy: ±0.035mm

Mounting Repeat positioning accuracy ±0.025mm

CPK≥1.0

SMT workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature.

With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board), and also can reduce the high temperature oxidation of solder and not easy to produce compounds with metal, but also to avoid metal oxidation because of air  nitrogen is an inert gas,  which to ensure the quality of solder and product Reliability.

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